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3D/Active edge sensors with FBK

→ Europe/Rome
Virtual Room

Virtual Room
Description
link alla agenda in area ATLAS https://agenda.infn.it/conferenceDisplay.py?confId=8220

VIDYO: http://vidyoportal.cern.ch/flex.html?roomdirect.html&key=E5DdQXGW4v5l
PIN : 0000
    • 1
      Introduction
      Speaker: Prof. Gian Franco Dalla Betta (University of Trento)
    • 2
      Epitaxial wafer procurement
      Speakers: Giovanni Darbo (GE), Marco Meschini (FI)
    • 3
      Status of batches (3D and new planar) and DRIE tests
      Speakers: Dr Gabriele Giacomini (FBK), Dr Sabina Ronchin (FBK)
    • 4
      Urgent action: plan for bump bonding
      Speakers: Prof. Gian Franco Dalla Betta (University of Trento), Giovanni Darbo (GE)
      Slides
    • 5
      Discussion on back-side metal for planar batch
    • 6
      News from meeting with referees in Pisa
      Speakers: Giovanni Darbo (GE), Marco Meschini (FI)
    • 7
      Next meeting
      Speaker: Prof. Gian Franco Dalla Betta (University of Trento)
    • 8
      Slide R&D per Referee Pisa 23/9/14
      Speaker: Marco Meschini (FI)
      Slides
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