3D/Active edge sensors with FBK (25 September 2014) · Agenda (Indico)

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3D/Active edge sensors with FBK

Thursday, 25 September 2014 - 09:00

Monday, 22 September 2014
Tuesday, 23 September 2014
Wednesday, 24 September 2014
Thursday, 25 September 2014
09:00 Introduction - Gian Franco Dalla Betta (University of Trento)
Introduction
- Gian Franco Dalla Betta (University of Trento)
09:00 - 09:10
09:10 Epitaxial wafer procurement - Giovanni Darbo (GE) Marco Meschini (FI)
Epitaxial wafer procurement
- Giovanni Darbo (GE)
- Marco Meschini (FI)
09:10 - 09:20
09:20 Status of batches (3D and new planar) and DRIE tests - Sabina Ronchin (FBK) Gabriele Giacomini (FBK)
Status of batches (3D and new planar) and DRIE tests
- Sabina Ronchin (FBK)
- Gabriele Giacomini (FBK)
09:20 - 09:40
09:40 Urgent action: plan for bump bonding - Gian Franco Dalla Betta (University of Trento) Giovanni Darbo (GE)
Urgent action: plan for bump bonding
- Gian Franco Dalla Betta (University of Trento)
- Giovanni Darbo (GE)
09:40 - 10:00
10:00 Discussion on back-side metal for planar batch
Discussion on back-side metal for planar batch
10:00 - 10:20
10:20 News from meeting with referees in Pisa - Giovanni Darbo (GE) Marco Meschini (FI)
News from meeting with referees in Pisa
- Giovanni Darbo (GE)
- Marco Meschini (FI)
10:20 - 10:40
10:40 Next meeting - Gian Franco Dalla Betta (University of Trento)
Next meeting
- Gian Franco Dalla Betta (University of Trento)
10:40 - 10:45
10:45 Slide R&D per Referee Pisa 23/9/14 - Marco Meschini (FI)
Slide R&D per Referee Pisa 23/9/14
- Marco Meschini (FI)
10:45 - 11:05

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