3D/Active edge sensors with FBK
Thursday 25 Sept 2014, 09:00
→
11:05
Europe/Rome
Virtual Room
Virtual Room
Description
link alla agenda in area ATLAS https://agenda.infn.it/conferenceDisplay.py?confId=8220
VIDYO:
http://vidyoportal.cern.ch/flex.html?roomdirect.html&key=E5DdQXGW4v5l
PIN : 0000
1
Introduction
Speaker
:
Prof.
Gian Franco Dalla Betta
(
University of Trento
)
2
Epitaxial wafer procurement
Speakers
:
Giovanni Darbo
(
GE
)
,
Marco Meschini
(
FI
)
3
Status of batches (3D and new planar) and DRIE tests
Speakers
:
Dr
Gabriele Giacomini
(
FBK
)
,
Dr
Sabina Ronchin
(
FBK
)
4
Urgent action: plan for bump bonding
Speakers
:
Prof.
Gian Franco Dalla Betta
(
University of Trento
)
,
Giovanni Darbo
(
GE
)
Slides
5
Discussion on back-side metal for planar batch
6
News from meeting with referees in Pisa
Speakers
:
Giovanni Darbo
(
GE
)
,
Marco Meschini
(
FI
)
7
Next meeting
Speaker
:
Prof.
Gian Franco Dalla Betta
(
University of Trento
)
8
Slide R&D per Referee Pisa 23/9/14
Speaker
:
Marco Meschini
(
FI
)
Slides
MM-ref-CMS-set14.pptx
MM-ref-common-set14.pptx
MMmod14-10-01_GD_RD_FASE2.pptx