3D/Active edge sensors with FBK
Thursday 25 Sept 2014, 09:00
→
11:05
Europe/Rome
Virtual Room
Virtual Room
Description
link alla agenda in area ATLAS https://agenda.infn.it/conferenceDisplay.py?confId=8220
VIDYO:
http://vidyoportal.cern.ch/flex.html?roomdirect.html&key=E5DdQXGW4v5l
PIN : 0000
09:00
→
09:10
Introduction
10m
Speaker
:
Prof.
Gian Franco Dalla Betta
(
University of Trento
)
09:10
→
09:20
Epitaxial wafer procurement
10m
Speakers
:
Giovanni Darbo
(
GE
)
,
Marco Meschini
(
FI
)
09:20
→
09:40
Status of batches (3D and new planar) and DRIE tests
20m
Speakers
:
Dr
Gabriele Giacomini
(
FBK
)
,
Dr
Sabina Ronchin
(
FBK
)
09:40
→
10:00
Urgent action: plan for bump bonding
20m
Speakers
:
Prof.
Gian Franco Dalla Betta
(
University of Trento
)
,
Giovanni Darbo
(
GE
)
Slides
10:00
→
10:20
Discussion on back-side metal for planar batch
20m
10:20
→
10:40
News from meeting with referees in Pisa
20m
Speakers
:
Giovanni Darbo
(
GE
)
,
Marco Meschini
(
FI
)
10:40
→
10:45
Next meeting
5m
Speaker
:
Prof.
Gian Franco Dalla Betta
(
University of Trento
)
10:45
→
11:05
Slide R&D per Referee Pisa 23/9/14
20m
Speaker
:
Marco Meschini
(
FI
)
Slides
MM-ref-CMS-set14.pptx
MM-ref-common-set14.pptx
MMmod14-10-01_GD_RD_FASE2.pptx