Speaker
Description
The ALICE experiment at the Large Hadron Collider (LHC) at CERN has planned an upgrade of the Inner Tracking System (ITS), called ITS3, which will be installed during the LHC Long Shutdown 3 (2026-2028). The upgrade will implement a new 65 nm CMOS Monolithic Active Pixel Sensor (MAPS) employing the stitching technology to create wafer-scale chips up to 26 cm long. The produced chips will be bent around the beam pipe to replace the three innermost layers of the existing detector with new ultra-light, truly cylindrical layers. The ITS3 will improve the tracking performance of the detector especially at low transverse momentum, thanks to better track impact-parameter resolution, improved by a factor of two with respect to the present ITS in LHC Run 3. The detector will be closer to the interaction point and will have a lower material budget, of 0.05% $X_{0}/$layer. The presentation will show the final configuration and structure of the ITS3, the challenges related to its design and construction, and the results of the current R&D program on the sensor design and characterization.
