Description
This session will be on display on Tuesday afternoon and Wednesday morning
Link to the contributions
The upgrade program of the CMS experiment in view of the LHC High Luminosity phase (HL-LHC) includes a replacement of the silicon pixel tracker. This is necessary to guarantee the same tracking performance of the current detector under harsher operating conditions, including higher radiation fluences and hit rates. The first layer of the central (barrel) detector will be located at radial...
A double-sided 3D trench electrode detector (DS-3DTED) structure is proposed in this work to investigate manufacturing process implementation of 3D detectors for high energy physics, X-ray spectroscopy and X-ray cosmology applications. The device electrical characteristics are carried out with TCAD tool, including electric potential and electric field distribution, I-V, C-V, full depletion...
The EXFLU1 batch of LGAD sensors on substrates of thickness between 15 and 45 $\mathrm{\mu}$m were exposed to various radiation grades between 1 $\times$ 10$^{-14}$ and 5 $\times$ 10$^{-15}$ n$_{\mathrm{eq}}$cm$^{-2}$ using the neutron reactor at JSI.
The sensor designs themselves, manufactured at FBK, are optimised to preserve characteristics at high fluences.
The latest studies of the...
CMOS Monolithic Active Pixel Sensors (MAPS) have become a prominent technology choice for tracking and vertexing detectors in high-energy physics
experiments over the last decades. The ALICE ITS3 project foresees the use of ultra-light MAPS, developed in the 65 nm imaging process, for the vertex
detector in the ALICE experiment at the LHC to improve the vertexing performance drastically....
The RD50-MPW4, the latest iteration in the HV-CMOS pixel sensor series developed collaboratively by the CERN-RD50-CMOS working group, marks a significant advancement in the RD50-MPW series. Rooted in generic research and development, the RD50-MPW program aims to address challenges posed by future physics experiments, such as HL-LHC and FCC, focusing on radiation tolerance, granularity, and...
The three innermost layers of the ALICE Inner Tracking System (ITS2) will be replaced by a truly cylindrical tracker, the ITS3, to be ready for LHC Run 4 (2029-2032). The ITS3 will be composed of three layers, each made by two self-supporting, ultra-thin (≤50 µm) flexible Monolithic Active Pixel silicon Sensors (MAPS) of large area (O(10×26 cm$^2$)).
The final sensor will be realized using...
This work will present the development and first tests of the Arc-detector. The Arc-detector is a multichip CdTe-Medipix3RX [1] detector system developed to bring the advantages of photon-counting detectors to applications in the hard X-ray range of energies. The detector head consists of 24 modules arranged in an ARC shape, covering a scattering angle of 100°. Each module consists of a...
The Upstream Tracker (UT) is a crucial component in the LHCb tracking system. The UT, currently being integrated in the LHCb Upgrade I detector, is a silicon microstrip detector that speeds up track reconstruction, reduces the rate of ghost tracks, and optimizes LHCb capabilities of reconstructing long-lived particles. LHCb is planning another major upgrade to be installed during Long-Shutdown...
The Large Hadron Collider (LHC) experiment is nearing the end of life at its current configuration. However, numerous upgrades across the machine and its detectors are scheduled to extend the lifetime of the experiment for more than an additional decade. The Inner Tracker (ITk) is the new, all-silicon tracker that will replace the current Inner Detector of the ATLAS spectrometer at the end of...
In recent years, DePFET (Depleted P-channel Field Effect Transistor) based sensors have been deployed for various applications, including particle tracking at Belle II experiment and for X-ray spectroscopy on board the planetary science mission BepiColombo. Future applications include real-time imagers for transmission electron microscopes (TEMs) and X-ray imaging spectroscopy on board the...
In the dynamic realm of silicon detector advancements, the pursuit of consistently improved timing precision has witnessed remarkable progress in recent years. Yet, the challenge remains to unlock the full potential for realizing large-area systems, showcasing the extraordinary time resolution demanded by next-generation experiments.
In the context of the future ALICE 3 experiment (2035,...
In the era of high-luminosity LHC, it is anticipated that the instantaneous luminosity will achieve unprecedented levels, leading to the occurrence of up to 200 proton-proton interactions during a typical bunch crossing. In response to the resulting surge in occupancy, bandwidth demands, and radiation damage, the ATLAS Inner Detector is slated for replacement by an all-silicon system known as...
For many years there has been an aspiration within the community to develop curved silicon detectors for particle physics applications. We present the results from 10x10cm low mass support modules as a part of the “ZeroMass” project that aims to minimise the material budget for tracking and vertexing systems for future colliders. We use 50 μm thick DC coupled strip sensors from Micron...
In order to cope with the demanding running conditions of the HL-LHC and to bring new and unique capabilities to the experiment, the Compact Muon Solenoid (CMS) detector will undergo a major upgrade. One novelty will be the introduction of a new MIP timing detector (MTD), which will allow the measurement of the time of charged particles with a resolution of 30-40 ps. The MTD will enable the...
The next generation of HEP experiments at future hadronic colliders (e.g., FCC-hh) will require tracking detectors to operate efficiently up to very high fluences (~ 1 $\times$ 10$^{17}$ 1 MeV n$_{eq}$/cm$^{2}$). The design of the peripheral region, i.e., the guard-ring (GR) structure, is crucial to obtain high performing silicon detectors able to sustain high voltage values with minimum...
In this contribution we present an innovative sensor concept suitable for 4D particle tracking, which is the result of combining two well-known technology solutions: the standard CMOS platform, on one side, and the AC-LGAD readout design, on the other. Being an evolution of the LGAD concept, AC-LGADs get rid of the no-gain area introduced by the isolation implants around each pixel thanks to...
The CMS Outer Tracker phase-2 upgrade is conditioned by the planned high-luminosity LHC (HL-LHC) project. The high radiation levels and the large pileup require a high granularity and low mass detector and the capability to handle high data rates. The OT modules will provide hit information to the Level 1 Trigger to form track segments, which allows to keep the trigger rates at a sustainable...
The new ATLAS Inner Tracker (ITk) will replace the current tracking detector of the ATLAS detector to cope with the challenging conditions for the Phase-II upgrade of the Large Hadron Collider experiment (LHC), the so-called High Luminosity LHC (HL-LHC). The new tracking detector is an all-silicon detector consisting of a pixel inner tracker and a silicon microstrips outer tracker,...
The continuous increase of instantaneous luminosity in high energy physics experiments will severely affect the occupancy of tracking detectors, drastically reducing event reconstruction efficiency.
In the case of the Upgrade II of the LHCb experiment at CERN, the detector will operate at an instantaneous luminosity of about $1.5\times 10^{34}~cm^{-2}s^{-1}$. In these conditions,...
During Long Shutdown 3, the entire CMS Tracking System will be replaced to operate during the High Luminosity LHC running phase with considerably increased luminosity. The pixel sensor modules for the CMS Inner Tracker will have to fulfill stringent requirements to operate in an extremely harsh radiation environment and to cope with the high data readout rate.
An extensive campaign has...
The High-Luminosity LHC (HL-LHC), currently foreseen to start towards 2029, will operate at an instantaneous luminosity of up to 7.5 × 1034 cm−2 s−1, corresponding to an unprecedented average number of proton-proton collisions per bunch crossing of up to 200. Efficient techniques to identify and suppress jets originating from pile-up interactions are critical to achieve the physics potential...
Wide bandgap alloys of II-VI group materials are widely used for gamma-photon detection. The more established CdZnTe alloy is recently being challenged by CdMnTe, which shown improved uniformity and wider tunable bandgap. These compounds mostly owe their high resistivity to deep level compensation process (Fermi level "pinning"). Therefore, such compound "semi-insulators" have high densities...
The inner detector of the ATLAS experiment will be completely replaced with a new all-silicon tracking detector (ITk) during the Long Shutdown 3 (2026-28) to cope with the challenging conditions that will be posed by the High Luminosity LHC (HL-LHC) after 2029.
The pixel detector will be located in the inmost part of ITk detector. As a fluence up to 2$\cdot$10$^{16}$ n$_{eq}$/cm$^2$ is...
The integration of readout electronics and sensor into a single entity of silicon in monolithic pixel detectors lowers the material budget while simplifying the production procedure compared to the conventional hybrid pixel detector concept. The increasing availability of high-resistivity substrates and high-voltage capabilities in commercial CMOS processes facilitate the application of...
MALTA is a fully-depleted Monolithic Active Pixel sensor (MAPs) developed in the Tower 180nm CMOS image sensor process. Compared to conventional tracking sensors, MAPs offer the potential for improved tracking performance and also easier integration and reduced cost due to the merger of readout and sensor. The MALTA pixel architecture is designed for high-rate and fast response time, and...
Certain applications of ionizing radiation detectors require extreme radiation hardness that is an especially sensitive issue for the electronic part of many of the detectors currently in use. Scintillator detectors have an advantage in the possibility of designing them in two remotely separated units, the all-optical detection unit and the electronic unit converting the optical signal to the...
The bulk damage of p-type silicon detectors caused by high doses of gamma irradiation has been studied. The study was carried out on different types of n+-in-p silicon diodes with various silicon bulk resistivities. The diodes were irradiated by Cobalt-60 gamma source to total ionizing doses ranging from 0.50 up to 8.28 MGy, and annealed for 80 minutes at 60°C. The main goal of the study was...
Silicon strip detectors in the Inner Tracker (ITk) of the upgraded ATLAS experiment at HL-LHC will have to operate in high radiation environment. The tracker is designed to withstand irradiation with 1 MeV neutron equivalent fluence of 1.6e15 n$_{\mathrm{eq}}$/cm$^2$ in the strip sensor region. To achieve such radiation hardness, extensive irradiation studies were performed during development...
Surface damage caused by ionizing radiation in SiO$_2$-passivated silicon particle detectors consists mainly of the accumulation of a positively charged layer along with trapped-oxide-charge and interface traps inside the oxide and close to the Si/SiO$_2$-interface. High density positive interface net charge can be detrimental to the operation of a multi-channel $n$-on-$p$ sensor since the...
Future frontier accelerators envisage the use of silicon sensors in environments with fluences exceeding 1$\times$$10^{17}$ 1 MeV $n_{eq}$/$cm^2$. Presently available silicon sensors can operate efficiently up to fluences of 2$\times$$10^{16}$ 1 MeV $n_{eq}$/$cm^2$, while the gain mechanism of Low-Gain Avalanche Diode (LGAD) sensors under irradiation is maintained up to a fluence of about...
The material properties of Silicon-Carbide (SiC) make it a promising candidate for application as a particle detector at high beam rates. Compared to Silicon (Si), the increase in charge carrier saturation velocity and breakdown voltage allow for high intrinsic time resolution while mitigating pile-ups. The larger band gap potentially improves radiation hardness, which, in combination with its...
The proposed upgrade of the Belle II Vertex Detector (VTX) uses the same OBELIX sensor on all its 5 layers.
OBELIX is a depleted monolithic active pixel sensor based on the TJ-Monopix2 chip, fabricated in a radiation
hard CMOS 180nm process.
The OBELIX pixel-matrix is inherited from its predecessor, in contrast the periphery is entirely reworked.
A newly designed 2-stage pixel memory...
