Jul 22 – 26, 2019
Europe/Rome timezone

title: on-chip spectrometry at THz frequencies and high resolving power

Jul 23, 2019, 5:45 PM
1h 15m
Piazza Città di Lombardia (Milano)

Piazza Città di Lombardia


Piazza Città di Lombardia, 1, 20124 Milano MI
Poster Low Temperature Detector fabrication techniques and materials Poster session


Prof. Erik Shirokoff (University of Chicago)


Building upon the legacy of SuperSpec, an on-chip spectrometer operating at 1-mm that will begin observations in 2019, we are pursuing new technologies that will extend this technology to higher frequencies and higher resolving powers. This requires the use of new dielectrics, including both amorphous silicon and crystal silicon using a flipped SOI wafer process, new microstrip materials that can operate above 1 THz, and low-volume aluminum kinetic inductance detectors with a very high response. In order to operate at frequencies as high as 2.5 THz, we are designing spectrometer prototype that uses cavity resonators fabricated from silicon wafers using deep reactive ion etching, followed by a repeated oxidation and HF smoothing process. We will present simulations and initial test data for the materials that will be used in these designs, and optical test results of the mm-wave properties of crystal-dielectric microstrip prototypes.

Student (Ph.D., M.Sc. or B.Sc.) N
Less than 5 years of experience since completion of Ph.D N

Primary authors

Prof. Erik Shirokoff (University of Chicago) Dr Peter Barry (Argonne National Lab) Dr C. M. Bradford (Jet Propulation Lab) Prof. Jefffrey Filippini (University of Illinois at Urbanna Champagne) Dr Steve Hailey-Dunsheath (California Institute of Technology) Dr H. G. LeDuc (Jet Propulation Laboratory) Mr Rong Nie (University of Illinois at Urbanna Champaigne) Prof. Michael Zemcov (Rochester University of Technology)

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