22–26 lug 2019
Milano
Europe/Rome fuso orario

Atomic Layer Deposition Josephson Junctions for Cryogenic Circuit Applications

23 lug 2019, 17:45
1O 15m
Piazza Città di Lombardia (Milano)

Piazza Città di Lombardia

Milano

Piazza Città di Lombardia, 1, 20124 Milano MI
Poster Low Temperature Detector fabrication techniques and materials Poster session

Relatore

Christine Jhabvala (NASA Goddard Space Flight Center)

Descrizione

Superconducting-insulating-superconducting (SIS) trilayers have been produced for Josephson Junction fabrication by thermal atomic layer deposition (ALD) processes. The trilayers are composed of alternating layers of Ti0.4N0.6/Al2O3/ Ti0.4N0.6, deposited at 450°C, in a thermal ALD reactor on Al2O3-coated silicon. The conformal nature of the ALD process provides excellent step coverage of superconducting and insulating films. The film thickness of a single ALD cycle being one mono-layer, allows us to precisely control the tunnel-barrier insulator thickness by counting the number of ALD cycles during the insulator deposition step. Tunnel-junctions with critical current 500 A/cm2 are reported. Fabrication of Josephson Junctions and progress toward development of a single-element ALD Superconducting Quantum Interference Device (SQUID) will be discussed.

Student (Ph.D., M.Sc. or B.Sc.) N
Less than 5 years of experience since completion of Ph.D N

Autore principale

Christine Jhabvala (NASA Goddard Space Flight Center)

Coautore

Dr. Thomas Stevenson (NASA) Dr. Peter Nagler (NASA Goddard Space Flight Center)

Materiali di presentazione