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3D/Active edge sensors with FBK

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Virtual Room
Description
link alla agenda in area ATLAS https://agenda.infn.it/conferenceDisplay.py?confId=8220

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    • 1
      Introduction
      Speaker: Prof. Gian Franco Dalla Betta (University of Trento)
    • 2
      Wafer procurement
      Speakers: Prof. Gian Franco Dalla Betta (University of Trento), Giovanni Darbo (GE)
      IceMOS Wafers
      Slides
    • 3
      Planar sensor layout
      Speakers: Alberto Messineo (PI), Gabriele Giacomini (Fondazione Bruno Kessler FBK)
      Slides
    • 4
      Status of 3D batch and DRIE tests
      Speaker: Dr Sabina Ronchin (FBK)
      Slides
    • 5
      Plans for bump-bonding
      Speakers: Alberto Messineo (PI), Giovanni Darbo (GE)
      Slides
    • 6
      Discussion
    • 7
      Next meeting
      Speaker: Prof. Gian Franco Dalla Betta (University of Trento)
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