Speaker
Description
At the BNL Electron Ion Collider, the ePIC experiment will investigate a broad and rich QCD and Nucleon physics program, requiring novel and high-performance detectors. An example is the Silicon Vertex Tracker (SVT), the closest detector to the collision point, dedicated to the secondary vertexes reconstruction. It has several innovative aspects, starting from sensors to the mechanics. It consists of three sub-systems: Inner Barrel (IB), Outer Barrel (OB), and Disks. The common innovative features are sensor technology, consisting of TPSCo 65 nm CMOS imaging MAPS, ultra-light mechanical structures, and air-cooling system.
The ePIC Italian community has the responsibility for the design and assembly of SVT Inner Barrel. The IB is composed of three layers, made of bent wafer-sized silicon sensors that will cover the cylindrical
tracking surfaces with a light support structure. The sensor bending is carried out following a specific and carefully designed procedure which is part of the detector half-layer assembly procedure. Several studies and tests are currently ongoing and foreseen both to refine the bending procedure and to finalise the detector design using prototypes constructed for these purposes. After an introduction to the ePIC SVT detector concept, in this contribution the details of the prototype assembly campaign and corresponding tests will be presented.