26 May 2024 to 1 June 2024
La Biodola - Isola d'Elba (Italy)
Europe/Rome timezone

Cooled SIPM for next generation of Ring Imaging Cherenkov detectors

27 May 2024, 15:31
3h 49m
Sala Elena

Sala Elena

Poster T8 - Integration and Detector Systems Integration and Detector Systems - Poster session

Speaker

Roberta Cardinale (INFN - Genova)

Description

The housing of the sensors for future Ring Imaging Cherenkov (RICH) detectors, regardless of the sensor choice, is a complex task, with many complex requirements. To optimize the required resources and simplify the design, different functions should be integrated in modular and self-contained functional units.

Silicon Photomultipliers (SiPMs) are among the potential photo-sensor candidates to be used in the future upgrades of the RICH detectors. The primary limitation lies in their high intrinsic dark-count noise after irradiation which could prevent to use them in single-photon mode unless operated at sufficiently low temperatures.

A module housing the SiPM sensors, the readout front-end electronics and all the ancillary services is under development. The starting point is the Elementary Cell (EC), the housing module presently used in the upgraded LHCb RICH detector.

The main challenge for the new EC will be the implementation of active cooling for the photo-sensors while also maximizing geometrical acceptance and managing the higher channel density due to the smaller pixel size than the current implementation, for all the front-end/back-end readout electronics.

Two independent cooling strategies are under consideration: a local cooling strategy, to
cool down a region around the sensor as small as possible, providing thermal insulation as close as possible to the sensor, thus minimizing the mass to cool and avoid problems with low
temperatures of surrounding objects, such as radiator gases, which may liquefy
if not insulated, or readout electronics; a global cooling
strategy, enclosing the photodetector assembly inside a cryostat. For local cooling, current industrial technologies for cooling solid-state devices, such as fluid micro-channel cooling, Peltier coolers, miniature cryo-coolers, and ceramics cooling plates, are under investigation. The requirements, the current design status, and the developed prototypes along with their characterization will be presented.

Role of Submitter I am the presenter

Primary author

Roberta Cardinale (INFN - Genova)

Presentation materials