Accedi

XII Front-End Electronics Workshop

12–16 giu 2023
Torino
Europe/Rome fuso orario

Lista contributi

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3. Design and test results of the Timepix4 ASIC
Xavier Llopart (CERN)
12/06/23, 10:00
4. Pixel detectors with built-in signal processing and bandwidth efficient data transmission
Giovanni Pinaroli (BNL)
12/06/23, 10:30
5. The ATLAS and CMS pixel front-end chips
Luca Pacher (Istituto Nazionale di Fisica Nucleare)
12/06/23, 11:30
7. Event-driven arbitrated protocols implemented in integrated readout circuits for segmented detectors
Dominik Gorni (BNL)
12/06/23, 12:00
8. Pixel ASICs for X-ray imaging
Roberto Dinapoli (PSI)
12/06/23, 14:00
9. Readout ASICs for photon science at LCLSII-HE
Lorenzo Rota (SLAC)
12/06/23, 14:30
10. DynamiX: a charge cancellation ASIC for high rate X-ray measurements with CdZnTe detectors
Thomas Gardiner (STFC)
12/06/23, 15:00
50. A digitally integrating charge pump frontend with pipelined digitisation and a flexible event-by-event hit processing for hybrid pixel detectors
Michael Ritzert (University of Heidelberg)
12/06/23, 15:30
11. The FAST ASICs family for high resolution timing applications
Nicolo' Cartiglia (Istituto Nazionale di Fisica Nucleare)
12/06/23, 16:30
12. The TimeSPOT pixel front-end IC in 28 nm CMOS
Adriano Lai (Istituto Nazionale di Fisica Nucleare)
12/06/23, 17:00
13. The ETROC chip for the CMS timing layers
Ted Liu (FNAL)
12/06/23, 17:30
14. FASTIC+: a general purpose fast readout including one TDC per channel
Joan Mauricio (University of Barcelona)
13/06/23, 09:00
15. The ALTIROC and LIROC ASICs for fast timing applications
Christophe De la Taille (OMEGA-CNRS/IN2P3)
13/06/23, 09:30
16. Timing circuits for HEP and ultrafast photon science
Bojan Markovic (SLAC)
13/06/23, 10:00
17. Low power, high accuracy ADCs and TDCs
Jakub Moron (AGH)
13/06/23, 11:00
18. Multiple stage ring oscillator Vernier-based TDC to optimize jitter, power consumption and conversion time
Guillaume Théberge-Dupuis (Université de Sherbrooke)
13/06/23, 11:30
19. A 3-step low power, multi-channel TDC based on time residual amplifiers
Florent Bouyjou (CEA)
13/06/23, 12:00
20. MONOLITH: project and results
Thanushan Kugathasan (University of Geneva)
13/06/23, 13:30
21. Status of CMOS pixel sensor prototypes for the CEPC vertex detector
Ying Zhang (IHEP)
13/06/23, 14:00
22. Development of monolithic sensors for high energy physics in TPSCo 65 nm ISC technology
Walter Snoeys (CERN)
13/06/23, 14:30
23. Results for the ARCADIA sensors in 110 nm CMOS technology
Lucio Pancheri (University of Trento)
13/06/23, 15:00
51. The ASICs for the CMS outer tracker upgrade
Alessandro Caratelli (CERN)
13/06/23, 16:00
25. The DSSC detector for the European XFEL: a soft X-ray Camera with Megaframe capability. System overview and new experimental results with low-noise DEPFET active pixels
Matteo Porro (European XFEL)
13/06/23, 16:30
26. BPIX: Pixel Readout Chip Development for the High Energy Photon Source
WEI Wei (IHEP)
13/06/23, 17:00
28. Multiple DC-DC converters for integrated systems
Franco Maloberti (University of Pavia)
14/06/23, 09:00
27. Reminiscing through 40 years of CMOS analog circuit design: from audio to GHz
Rinaldo Castello (University of Pavia)
14/06/23, 09:45
29. ASIC design support from CERN
Alessandro Caratelli (CERN)
14/06/23, 11:00
30. Highly-Digital Approach Towards FE Design
Soumyajit Mandal (BNL)
14/06/23, 11:30
31. 65nm IP development for CMOS sensors at the Electron-Ion Collider
Soniya Mathew (STFC)
14/06/23, 12:00
32. ASTRA: a high dynamic range front end embedded with HV monolithic silicon micro-strip sensors
Fabio Cossio (Istituto Nazionale di Fisica Nucleare)
14/06/23, 12:30
33. The SLIDER32 front-end chip for X-ray spectrometry and tracking in the GAPS experiment
Massimo Manghisoni (Istituto Nazionale di Fisica Nucleare)
15/06/23, 09:00
34. The HGCROC for CMS high granularity calorimeter
Damien THIENPONT (CNRS/IN2P3/LAL-OMEGA)
15/06/23, 09:30
35. The CATIA large dynamic range preamplifier for the CMS ECAL upgrade
Fabrice Guilloux (CEA)
15/06/23, 10:00
40. The FLAME and FLAXE ASICs
Marek Idzik (AGH)
15/06/23, 10:30
36. Cryogenic CMOS in ultra scaled technologies
Dennis Nielinger (Forschungszentrum Juelich GmbH)
15/06/23, 11:30
37. ASICs for noble liquid detectors
Dr. Sergio Rescia (Brookhaven National Laboratory)
15/06/23, 12:00
39. The cryogenic ALCOR ASIC for SiPM readout
Giulio Dellacasa (INFN)
15/06/23, 12:30
38. Hybrid Cryogenic Detector Architectures for sensing and edge computing enabled by new fabrication processes (HYDRA)
Davide Braga (FNAL)
15/06/23, 14:00
41. MIRA: a Low-Noise ASIC with 35 µm pixel for the readout of Microchannel Plates
Carlo Ettore Nicola Fiorini (Istituto Nazionale di Fisica Nucleare)
15/06/23, 14:30
42. Dealing with DCR in SPADs and SiPMs in CMOS technology: characterization and design perspectives
Lodovico Ratti (Università di Pavia and INFN)
15/06/23, 15:00
43. SiPM front-end for CTA
Francesco Licciulli (Istituto Nazionale di Fisica Nucleare)
15/06/23, 15:30
1. IPs in 28 nm CMOS
Franco Bandi (CERN)
15/06/23, 16:30
2. Front-end for hybrid pixel detectors in 28 nm
Luigi Gaioni (University of Bergamo)
15/06/23, 17:00
44. Characterisation and application of a CMOS SPAD sensor for readout of optical fibres
Benedict Maisano (University of Heidelberg)
15/06/23, 17:30
45. Towards Silicon Photonics for HEP detectors
Fabrizio Palla (Istituto Nazionale di Fisica Nucleare)
15/06/23, 18:00
46. ANNA: Analog Neural Network ASIC for radiation detectors
Susanna Di Giacomo (Polimi)
16/06/23, 09:00
47. Overview of Fermilab's Quantum and AI chip designs
Farah Fahim (FNAL)
16/06/23, 09:30
48. Wide band-gap semiconductor sensors and front-ends for harsh environments
Tetsuichi KISHISHITA (KEK)
16/06/23, 10:00
49. 3D-bonded SOI pixel detectors
Yunpeng Lu (IHEP)
16/06/23, 10:30
24. A digitally integrating charge pump frontend with pipelined digitisation and a flexible event-by-event hit processing for hybrid pixel detectors
Michael Ritzert (University of Heidelberg)
6. ASICs for the CMS outer tracker upgrade
Alessandro Caratelli (CERN)
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