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XII Front-End Electronics Workshop

Jun 12 – 16, 2023
Torino
Europe/Rome timezone

Contribution List

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  1. 3. Design and test results of the Timepix4 ASIC
    Xavier Llopart (CERN)
    6/12/23, 10:00 AM
  2. 4. Pixel detectors with built-in signal processing and bandwidth efficient data transmission
    Giovanni Pinaroli (BNL)
    6/12/23, 10:30 AM
  3. 5. The ATLAS and CMS pixel front-end chips
    Luca Pacher (Istituto Nazionale di Fisica Nucleare)
    6/12/23, 11:30 AM
  4. 7. Event-driven arbitrated protocols implemented in integrated readout circuits for segmented detectors
    Dominik Gorni (BNL)
    6/12/23, 12:00 PM
  5. 8. Pixel ASICs for X-ray imaging
    Roberto Dinapoli (PSI)
    6/12/23, 2:00 PM
  6. 9. Readout ASICs for photon science at LCLSII-HE
    Lorenzo Rota (SLAC)
    6/12/23, 2:30 PM
  7. 10. DynamiX: a charge cancellation ASIC for high rate X-ray measurements with CdZnTe detectors
    Thomas Gardiner (STFC)
    6/12/23, 3:00 PM
  8. 50. A digitally integrating charge pump frontend with pipelined digitisation and a flexible event-by-event hit processing for hybrid pixel detectors
    Michael Ritzert (University of Heidelberg)
    6/12/23, 3:30 PM
  9. 11. The FAST ASICs family for high resolution timing applications
    Nicolo' Cartiglia (Istituto Nazionale di Fisica Nucleare)
    6/12/23, 4:30 PM
  10. 12. The TimeSPOT pixel front-end IC in 28 nm CMOS
    Adriano Lai (Istituto Nazionale di Fisica Nucleare)
    6/12/23, 5:00 PM
  11. 13. The ETROC chip for the CMS timing layers
    Ted Liu (FNAL)
    6/12/23, 5:30 PM
  12. 14. FASTIC+: a general purpose fast readout including one TDC per channel
    Joan Mauricio (University of Barcelona)
    6/13/23, 9:00 AM
  13. 15. The ALTIROC and LIROC ASICs for fast timing applications
    Christophe De la Taille (OMEGA-CNRS/IN2P3)
    6/13/23, 9:30 AM
  14. 16. Timing circuits for HEP and ultrafast photon science
    Bojan Markovic (SLAC)
    6/13/23, 10:00 AM
  15. 17. Low power, high accuracy ADCs and TDCs
    Jakub Moron (AGH)
    6/13/23, 11:00 AM
  16. 18. Multiple stage ring oscillator Vernier-based TDC to optimize jitter, power consumption and conversion time
    Guillaume Théberge-Dupuis (Université de Sherbrooke)
    6/13/23, 11:30 AM
  17. 19. A 3-step low power, multi-channel TDC based on time residual amplifiers
    Florent Bouyjou (CEA)
    6/13/23, 12:00 PM
  18. 20. MONOLITH: project and results
    Thanushan Kugathasan (University of Geneva)
    6/13/23, 1:30 PM
  19. 21. Status of CMOS pixel sensor prototypes for the CEPC vertex detector
    Ying Zhang (IHEP)
    6/13/23, 2:00 PM
  20. 22. Development of monolithic sensors for high energy physics in TPSCo 65 nm ISC technology
    Walter Snoeys (CERN)
    6/13/23, 2:30 PM
  21. 23. Results for the ARCADIA sensors in 110 nm CMOS technology
    Lucio Pancheri (University of Trento)
    6/13/23, 3:00 PM
  22. 51. The ASICs for the CMS outer tracker upgrade
    Alessandro Caratelli (CERN)
    6/13/23, 4:00 PM
  23. 25. The DSSC detector for the European XFEL: a soft X-ray Camera with Megaframe capability. System overview and new experimental results with low-noise DEPFET active pixels
    Matteo Porro (European XFEL)
    6/13/23, 4:30 PM
  24. 26. BPIX: Pixel Readout Chip Development for the High Energy Photon Source
    WEI Wei (IHEP)
    6/13/23, 5:00 PM
  25. 28. Multiple DC-DC converters for integrated systems
    Franco Maloberti (University of Pavia)
    6/14/23, 9:00 AM
  26. 27. Reminiscing through 40 years of CMOS analog circuit design: from audio to GHz
    Rinaldo Castello (University of Pavia)
    6/14/23, 9:45 AM
  27. 29. ASIC design support from CERN
    Alessandro Caratelli (CERN)
    6/14/23, 11:00 AM
  28. 30. Highly-Digital Approach Towards FE Design
    Soumyajit Mandal (BNL)
    6/14/23, 11:30 AM
  29. 31. 65nm IP development for CMOS sensors at the Electron-Ion Collider
    Soniya Mathew (STFC)
    6/14/23, 12:00 PM
  30. 32. ASTRA: a high dynamic range front end embedded with HV monolithic silicon micro-strip sensors
    Fabio Cossio (Istituto Nazionale di Fisica Nucleare)
    6/14/23, 12:30 PM
  31. 33. The SLIDER32 front-end chip for X-ray spectrometry and tracking in the GAPS experiment
    Massimo Manghisoni (Istituto Nazionale di Fisica Nucleare)
    6/15/23, 9:00 AM
  32. 34. The HGCROC for CMS high granularity calorimeter
    Damien THIENPONT (CNRS/IN2P3/LAL-OMEGA)
    6/15/23, 9:30 AM
  33. 35. The CATIA large dynamic range preamplifier for the CMS ECAL upgrade
    Fabrice Guilloux (CEA)
    6/15/23, 10:00 AM
  34. 40. The FLAME and FLAXE ASICs
    Marek Idzik (AGH)
    6/15/23, 10:30 AM
  35. 36. Cryogenic CMOS in ultra scaled technologies
    Dennis Nielinger (Forschungszentrum Juelich GmbH)
    6/15/23, 11:30 AM
  36. 37. ASICs for noble liquid detectors
    Dr Sergio Rescia (Brookhaven National Laboratory)
    6/15/23, 12:00 PM
  37. 39. The cryogenic ALCOR ASIC for SiPM readout
    Giulio Dellacasa (INFN)
    6/15/23, 12:30 PM
  38. 38. Hybrid Cryogenic Detector Architectures for sensing and edge computing enabled by new fabrication processes (HYDRA)
    Davide Braga (FNAL)
    6/15/23, 2:00 PM
  39. 41. MIRA: a Low-Noise ASIC with 35 µm pixel for the readout of Microchannel Plates
    Carlo Ettore Nicola Fiorini (Istituto Nazionale di Fisica Nucleare)
    6/15/23, 2:30 PM
  40. 42. Dealing with DCR in SPADs and SiPMs in CMOS technology: characterization and design perspectives
    Lodovico Ratti (Università di Pavia and INFN)
    6/15/23, 3:00 PM
  41. 43. SiPM front-end for CTA
    Francesco Licciulli (Istituto Nazionale di Fisica Nucleare)
    6/15/23, 3:30 PM
  42. 1. IPs in 28 nm CMOS
    Franco Bandi (CERN)
    6/15/23, 4:30 PM
  43. 2. Front-end for hybrid pixel detectors in 28 nm
    Luigi Gaioni (University of Bergamo)
    6/15/23, 5:00 PM
  44. 44. Characterisation and application of a CMOS SPAD sensor for readout of optical fibres
    Benedict Maisano (University of Heidelberg)
    6/15/23, 5:30 PM
  45. 45. Towards Silicon Photonics for HEP detectors
    Fabrizio Palla (Istituto Nazionale di Fisica Nucleare)
    6/15/23, 6:00 PM
  46. 46. ANNA: Analog Neural Network ASIC for radiation detectors
    Susanna Di Giacomo (Polimi)
    6/16/23, 9:00 AM
  47. 47. Overview of Fermilab's Quantum and AI chip designs
    Farah Fahim (FNAL)
    6/16/23, 9:30 AM
  48. 48. Wide band-gap semiconductor sensors and front-ends for harsh environments
    Tetsuichi KISHISHITA (KEK)
    6/16/23, 10:00 AM
  49. 49. 3D-bonded SOI pixel detectors
    Yunpeng Lu (IHEP)
    6/16/23, 10:30 AM
  50. 24. A digitally integrating charge pump frontend with pipelined digitisation and a flexible event-by-event hit processing for hybrid pixel detectors
    Michael Ritzert (University of Heidelberg)
  51. 6. ASICs for the CMS outer tracker upgrade
    Alessandro Caratelli (CERN)