3D/Active edge sensors with FBK

Monday 27 Oct 2014, 15:45 → 18:15 Europe/Rome

Virtual Room

link alla agenda in area ATLAS https://agenda.infn.it/conferenceDisplay.py?confId=8220

VIDYO: http://vidyoportal.cern.ch/flex.html?roomdirect.html&key=E5DdQXGW4v5l
PIN : 0000

15:45 → 15:55 Introduction

Speaker: Prof. Gian Franco Dalla Betta (University of Trento)

15:55 → 16:15 Epitaxial wafer procurement and orders of new batches

Speakers: Giovanni Darbo (GE), Marco Meschini (FI), Mr Maurizio Boscardin (FBK)

16:15 → 16:30 Status of batches (3D and new planar) and DRIE tests

Speakers: Mr Maurizio Boscardin (FBK), Dr Sabina Ronchin (FBK)

Slides DRIE_hole_test_27nov2014.pdf

16:30 → 16:50 Continued discussion: plans for sensor usage

Tests, bump bonding, thinning, etc.

16:50 → 17:05 Proposal for new 3D batch floorplan

Speaker: Prof. Gian Franco Dalla Betta (University of Trento)

Slides New_3D_Layout.pptx

17:05 → 17:10 Next meeting

Speaker: Prof. Gian Franco Dalla Betta (University of Trento)