3D/Active edge sensors with FBK

Tuesday 29 Jul 2014, 15:00 → 17:00 Europe/Rome

Virtual Room

link alla agenda in area ATLAS https://agenda.infn.it/conferenceDisplay.py?confId=8220

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1 Introduction

Speaker: Prof. Gian Franco Dalla Betta (University of Trento)

2 Wafer procurement

Speakers: Prof. Gian Franco Dalla Betta (University of Trento), Giovanni Darbo (GE)

IceMOS Wafers https://espace.cern.ch/hep-project-INFN-PixelRD/Sensors/Shared%20Documents/Forms/AllItems.aspx?RootFolder=%2Fhep%2Dproject%2DINFN%2DPixelRD%2FSensors%2FShared%20Documents%2FIcemos&FolderCTID=0x01200088ED6375B718C640BCF3A611F86F9604&View={75747BB2-E496-4A12-8549-2890824FF67F}

Slides 390DEP8009-00_DeliverySpecificationE.p2.pptx

3 Planar sensor layout

Speakers: Alberto Messineo (PI), Gabriele Giacomini (Fondazione Bruno Kessler FBK)

Slides Modifiche_Strutture_ATLAS.pptx

4 Status of 3D batch and DRIE tests

Speaker: Dr Sabina Ronchin (FBK)

Slides Si_3D_FBK_status_27-07-14.pptx

5 Plans for bump-bonding

Speakers: Alberto Messineo (PI), Giovanni Darbo (GE)

Slides 14-07-29_GD_ACTIVE_BB.pdf

6 Discussion

7 Next meeting

Speaker: Prof. Gian Franco Dalla Betta (University of Trento)