Speaker
Description
At the BNL Electron Ion Collider, the ePIC experiment will investigate a broad and rich QCD and Nucleon physics program, requiring novel and high-performance detectors. An example is its Silicon Vertex Tracker (SVT). It has several innovative aspects, starting from sensors to the mechanics. It consists of three sub-systems: Inner Barrel (IB), Outer Barrel (OB), and Disks. The common innovative features are sensor technology, consisting of radiation-hardened TPSCo 65 nm CMOS imaging Monolithic Active Pixel sensor chips, ultra-light mechanical structures, and air cooling system.
In the IB, bent wafer-sized chips will directly cover the cylindrical tracking surfaces. Their mechanical bending occurs during the assembly of the detector layers, outside the TPSCo company. Even if the challenges of the assembly procedure are faced in synergy with the ALICE ITS3 project, the larger radii of the IB cylinders drive dedicated R&D solutions for the SVT sub-system.
The OB and Disks will cover larger areas, which led to different segmentations and layouts of power supply and data transmission. Therefore, the design of OB and Disks sensors slightly differs from the IB and ALICE ITS3 sensors.
Several studies are in advanced status to finalise the detector design, using simulation frameworks or preliminary mock-ups. They will be reported and discussed in this contribution, after describing the most recent design of SVT.
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