Speakers
Description
High-Intensity 4D-tracking requires to match challenging requirements both in sensors and electronics development. The IGNITE project develops technical solutions for the next generation of trackers at colliders, planning to implement an integrated module, comprising sensor, electronics, and fast readout. System pixels are required to have pitch around 50 µm and time resolution below 30 ps.
The talk shows results on 3D silicon sensors concerning their performance in timing (10 ps) and radiation resistance (up to 10 18 n eq /cm 2 ). It also illustrates results about of a first-born prototype ASIC (Ignite0), which explores circuital solutions for Analog Front End and Time-to-Digital Converter circuits. After measurements, the AFE and TDC show time resolution around 20 ps rms. Such prototype structures have been tested before being integrated in a subsequent design, containing a 64x64 pixel matrix for the readout of pixelated sensors. We also present the design criteria (Fractal design) and expected performance of the Ignite64 ASIC, recently submitted for fabrication. Furthermore, specific strategies for a fully scalable design, up to 256x256 pixels, are illustrated and discussed.
