Speaker
Mr
Maurizio Boscardin
(FBK)
Description
The support and cooling structures add an important contribution to the total material of vertex detectors.
In order to minimize the material budget of pixel sensors, we developed a new approach to integrate the cooling - into the silicon devices – based on the microchannel technology.
The microchannels are formed in silicon using isotropic SF6 plasma etching in a DRIE (deep reactive ion etcher) equipment. Due to their peculiar profiles, the channels can be sealed by a layer of a PECVD silicon oxide. We have realized on a silicon wafer microchannels with different geometries and hydraulic diameters. We describe the main fabrication steps of microchannels with focus on the channel definition. We report the experimental results on the thermal characterization of several prototypes, using a mixture of glycol and water as a liquid coolant. The prototypes have shown high cooling efficiency and high-pressure breaking strength.
Primary author
Mr
Maurizio Boscardin
(FBK)
Co-authors
Prof.
FIlippo Bosi
(INFN Sezione di Pisa)
Dr
Michele Crivellari
(FBK)
Dr
Paolo Conci
(FBK)
Dr
Sabina Ronchin
(FBK)
Prof.
Stefano Bettarini
(INFN Sezione di Pisa)
