22–28 May 2022
La Biodola - Isola d'Elba (Italy)
Europe/Rome timezone
submission of the proceedings for the PM2021 has been postponed to July 31, 2022

10ps timing with 3D trench silicon pixel sensors

24 May 2022, 11:10
15m
La Biodola - Isola d'Elba (Italy)

La Biodola - Isola d'Elba (Italy)

Speaker

Alessandro Cardini (Istituto Nazionale di Fisica Nucleare)

Description

Future collider experiments operating at very high instantaneous luminosity will greatly benefit in using detectors with excellent time resolution to facilitate event reconstruction. For the LHCb Upgrade2, when the experiment will operate at 1.5x10^34/cm/s, 2000 tracks from 40 pp interactions will cross the vertex detector (VELO) at each bunch crossing. To properly reconstruct primary vertices and b-hadron decay vertices VELO hit time stamping with 50ps accuracy is required. To achieve this, several technologies are under study and one of the most promising today is the 3D trench silicon pixel, developed by the INFN TimeSPOT collaboration. These 55µmx55µm pixels are built on a 150µm-thick silicon and consist of a 40µm-long planar junction located between two continuous bias junctions, providing charge-carriers drift paths of about 20µm and signals’ total durations close to 300ps. Two sensors’ batches were produced by FBK in 2019 and 2021. The most recent sensors’ beam test was performed at SPS/H8 in 2021. Various test structures were readout by means of low-noise custom electronics boards featuring a two-stage transimpedance amplifier, and the output signals were acquired with an 8GHz 20GS/s oscilloscope. The arrival time of each particle was measured with an accuracy of about 7ps using two 5.5mm-thick quartz window MCP-PMTs. Two 3D trench silicon pixel test structures and the two MCP-PMTs were aligned on the beam line and acquired in coincidence. Signal waveforms were analyzed offline with software algorithms and pixel signal amplitudes, particle time of arrival and efficiencies were measured. A preliminary analysis indicates efficiencies close to 100% for particles impinging at more than 10 degrees with respect to normal incidence, and time resolutions close to 10ps. More up-to-date results will be presented at the Conference. 3D trench-type silicon pixels appear to be a promising technology for future vertex detectors operating at very high instantaneous luminosity.

Collaboration on behalf of the TimeSPOT Collaboration

Primary authors

Adriano Lai (Istituto Nazionale di Fisica Nucleare) Alessandro Cardini (Istituto Nazionale di Fisica Nucleare) Andrea Lampis (Istituto Nazionale di Fisica Nucleare) Enrico Robutti (Istituto Nazionale di Fisica Nucleare) Federica Borgato (Istituto Nazionale di Fisica Nucleare) Maria Margherita Obertino (Istituto Nazionale di Fisica Nucleare) Michela Garau (Istituto Nazionale di Fisica Nucleare) Roberto Mulargia (Istituto Nazionale di Fisica Nucleare) Stefania Vecchi (Istituto Nazionale di Fisica Nucleare)

Presentation materials