Apr 19 – 21, 2017
Trieste - Italia
Europe/Rome timezone
Proceedings: Il Nuovo Cimento C, Vol. 41, N. 1-2, 2018 : https://www.sif.it/riviste/sif/ncc/econtents/2018/041/01-02

Development and test of Thin, Narrow-Pitch 3D Pixel Sensors for HL-LHC

Apr 21, 2017, 5:00 PM
Aula Magna - Edificio H3 (Trieste - Italia)

Aula Magna - Edificio H3

Trieste - Italia

Università degli Studi di Trieste Via Valerio nº 12/2 I-34127 Trieste (TS)
Poster contribution Sessione Nuove Tecnologie Archivio Poster


Mr Roberto Mendicino on behalf of the INFN-FBK Phase2 Collaboration. (TIFPA)


During the 2024-2025 shutdown, the Large Hadron Collider (LHC) will be upgraded to reach an instantaneous luminosity of up to 7×1034 cm-2 s-1 (phase-2 upgrade). ATLAS and CMS detectors will be deeply renewed to meet the new challenges: an average of 200 pile-up events in every bunch crossing and an integrated luminosity of 3000-4000 fb-1 over ten years or more. A first batch of new 3D pixel sensors oriented to the Phase 2 Upgrade was fabricated at FBK Trento on 6” Si-Si Direct Wafer Bonded substrates. These sensors have increased pixel granularity (e.g., 50×50 or 25×100 µm2 pixel size), thinner active layer (~100 µm) with columnar electrodes having narrower size (~5 µm) and reduced spacing (~30 µm), as required for high radiation hardness (up to a fluence of 2×1016 neq cm-2). In this contribution we present laboratory measurements, such as IV curves and charge collection using radioactive sources and laser setup, and also preliminary measurements of efficiency and charge collection from a test beam at the Cern SPS. An overview of the technological and design aspects relevant to the fabrication of the second batch, funded by the AIDA- 2020 project, will be also presented.

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