Speaker
Mr
Roberto Mendicino on behalf of the INFN-FBK Phase2 Collaboration.
(TIFPA)
Description
During the 2024-2025 shutdown, the Large Hadron Collider (LHC) will be upgraded to reach an instantaneous luminosity of up to 7×1034 cm-2 s-1 (phase-2 upgrade). ATLAS and CMS detectors will be deeply renewed to meet the new challenges: an average of 200 pile-up events in every bunch crossing and an integrated luminosity of 3000-4000 fb-1 over ten years or more. A first batch of new 3D pixel sensors oriented to the Phase 2 Upgrade was fabricated at FBK Trento on 6” Si-Si Direct Wafer Bonded substrates. These sensors have increased pixel granularity (e.g., 50×50 or 25×100 µm2 pixel size), thinner active layer (~100 µm) with columnar electrodes having narrower size (~5 µm) and reduced spacing (~30 µm), as required for high radiation hardness (up to a fluence of 2×1016 neq cm-2). In this contribution we present laboratory measurements, such as IV curves and charge collection using radioactive sources and laser setup, and also preliminary measurements of efficiency and charge collection from a test beam at the Cern SPS. An overview of the technological and design aspects relevant to the fabrication of the second batch, funded by the AIDA- 2020 project, will be also presented.