3D/Active edge sensors with FBK

Tuesday 9 Dec 2014, 14:00 → 16:30 Europe/Rome

Virtual Room

link alla agenda in area ATLAS https://agenda.infn.it/conferenceDisplay.py?confId=8220

VIDYO: http://vidyoportal.cern.ch/flex.html?roomdirect.html&key=E5DdQXGW4v5l
PIN : 0000

1 Introduction

Speaker: Prof. Gian Franco Dalla Betta (University of Trento)

Slides Bump_pad_layout_3D.pdf

2 Wafer procurement (epi or SOI)

Speakers: Giovanni Darbo (GE), Marco Meschini (FI), Mr Maurizio Boscardin (FBK)

3 Status of batches (3D and new planar) and DRIE tests

Speakers: Mr Maurizio Boscardin (FBK), Dr Sabina Ronchin (FBK)

4 Next meeting

Speaker: Prof. Gian Franco Dalla Betta (University of Trento)