Eva's minutes of 30/01/2026 meeting on LFoundry submission
Information:
- Target submission date: 5th June. To be double checked with the design teams by the end of February, before Philippe and Eva give LFoundry the required 3 months' advance notice
- Only MIM capacitors of 2 fF will be available (MIM 1 fF will NOT be available)
- Regarding dicing, we will aim to mutualise wafers as much as possible while keeping dicing complexity and cost under control. The aimed rationale is to dice large chips together and small chips together. However, it is essential that the processing options required are compatible among the chips that are diced together.
Actions for the design teams:
- Check the final sizes of the designs, including the scribe lines (see the floorplan and chip sizes in the attached slides)
- Get in touch with Philippe and Eva to let them know if backside processing and thinning are required (and, if so, specify the desired final thickness), and also how many chips the teams would like to receive. Deadline to provide preliminary inputs is end of February, to have these details available when getting in touch with LFoundry.
- For HV-Pix26 and Monstera1: confirm desginated organisation to be invoiced for these chips
Actions for Philippe and Eva:
- To cross-check with LFoundry:
- if teams can submit a preliminary GDS before the submission date (e.g. to start checking the DRC errors)
- the cost of the custom reserved layers
- if wafers beyond the committed 15, up to the fabricated 25 wafers, incur any additional costs
- Double check the list of project participiants to confirm the RD50 contribution towards the submission costs
- Create a dedicated project/Indico in the DRD3 pages