Speaker
Description
The SiliciSpazio INFN project plans to evaluate LGAD and MAPS detectors for space applications. In parallel, the project aims to advance the packaging of such detectors, testing ultra-thin flexible solutions that could drastically improve payload miniaturisation and the design of the space electronics and harnesses. The packaging will involve the TAB bonding method, which provides higher reliability and improved high frequency performance compared to standard wire bonding. These methods are critical to the goal of the miniaturization of the packaging and to eliminate the need for encapsulation. The R&D will identify the main challenges to be overcome in order to transfer such state-of-the-art technologies from HEP to Space and focus on two main topics.
The first topic is to understand the extent to which detectors’ packaging can have a lightweight design and still provide robustness for space: flexible packaging will reduce over-engineering and an approach of stiffening only where needed will be applied. The second topic concerns the handling and bonding of miniaturized flexible cables, which will be extended to successive generations of MAPS detectors, which are larger than the ALTAI chips of 4.5 cm2, that were previously qualified for space by the Limadou collaboration in the HEPD-02 payload.
