Speaker
Description
The ATLAS Experiment is building a complete new Silicon tracker, so called ITk, to face the challenges imposed by the HL-LHC phase in terms of instantaneous and integrated luminosity. The tracker will have pixel detectors in the innermost part and strip detectors in the outermost part. To deal with the high fluence, the innermost layer of the pixel detector will be instrumented by 3D sensors, that are extremely radiation hard, while the rest of the layers will host planar sensors.
The 3D sensors are produced by two vendors, SINTEF (Norway) and FBK (Italy) in two pixel pitches. In fact, to optimize the tracking performance, it is foreseen to use 50x50 um2 squared pixel in the forward region and 25x100 um2 rectangular pixel in the barrel section. In total there are three different sensors flavours: squared and rectangular from FBK and squared from SINTEF.
In this talk, we will review the laboratory measurements done to characterize the 3D sensors flavours. In particular, we will focus on the cross-talk between pixels, threshold and noise stability, and the evaluation of the active area of the edge pixels. Measurements are generally done as a function of the threshold and bias voltage, to better compare with the design expectations.
