3D/Active edge sensors with FBK
Tuesday, 2 December 2014 -
14:00
Monday, 1 December 2014
Tuesday, 2 December 2014
14:00
Introduction
-
Gian Franco Dalla Betta
(
University of Trento
)
Introduction
Gian Franco Dalla Betta
(
University of Trento
)
14:00 - 14:10
14:10
Wafer procurement (epi or SOI)
-
Marco Meschini
(
FI
)
Giovanni Darbo
(
GE
)
Maurizio Boscardin
(
FBK
)
Wafer procurement (epi or SOI)
Marco Meschini
(
FI
)
Giovanni Darbo
(
GE
)
Maurizio Boscardin
(
FBK
)
14:10 - 14:40
14:40
Status of batches (3D and new planar) and DRIE tests
-
Sabina Ronchin
(
FBK
)
Maurizio Boscardin
(
FBK
)
Status of batches (3D and new planar) and DRIE tests
Sabina Ronchin
(
FBK
)
Maurizio Boscardin
(
FBK
)
14:40 - 15:10
15:10
Continued discussion: plans for sensor usage
Continued discussion: plans for sensor usage
15:10 - 15:40
Tests, bump bonding, thinning, etc.
15:40
New 3D layout
-
Gian Franco Dalla Betta
(
University of Trento
)
New 3D layout
Gian Franco Dalla Betta
(
University of Trento
)
15:40 - 15:55
15:55
Next meeting
-
Gian Franco Dalla Betta
(
University of Trento
)
Next meeting
Gian Franco Dalla Betta
(
University of Trento
)
15:55 - 16:00