3D/Active edge sensors with FBK
Thursday, 25 September 2014 -
09:00
Monday, 22 September 2014
Tuesday, 23 September 2014
Wednesday, 24 September 2014
Thursday, 25 September 2014
09:00
Introduction
-
Gian Franco Dalla Betta
(
University of Trento
)
Introduction
Gian Franco Dalla Betta
(
University of Trento
)
09:00 - 09:10
09:10
Epitaxial wafer procurement
-
Giovanni Darbo
(
GE
)
Marco Meschini
(
FI
)
Epitaxial wafer procurement
Giovanni Darbo
(
GE
)
Marco Meschini
(
FI
)
09:10 - 09:20
09:20
Status of batches (3D and new planar) and DRIE tests
-
Sabina Ronchin
(
FBK
)
Gabriele Giacomini
(
FBK
)
Status of batches (3D and new planar) and DRIE tests
Sabina Ronchin
(
FBK
)
Gabriele Giacomini
(
FBK
)
09:20 - 09:40
09:40
Urgent action: plan for bump bonding
-
Gian Franco Dalla Betta
(
University of Trento
)
Giovanni Darbo
(
GE
)
Urgent action: plan for bump bonding
Gian Franco Dalla Betta
(
University of Trento
)
Giovanni Darbo
(
GE
)
09:40 - 10:00
10:00
Discussion on back-side metal for planar batch
Discussion on back-side metal for planar batch
10:00 - 10:20
10:20
News from meeting with referees in Pisa
-
Giovanni Darbo
(
GE
)
Marco Meschini
(
FI
)
News from meeting with referees in Pisa
Giovanni Darbo
(
GE
)
Marco Meschini
(
FI
)
10:20 - 10:40
10:40
Next meeting
-
Gian Franco Dalla Betta
(
University of Trento
)
Next meeting
Gian Franco Dalla Betta
(
University of Trento
)
10:40 - 10:45
10:45
Slide R&D per Referee Pisa 23/9/14
-
Marco Meschini
(
FI
)
Slide R&D per Referee Pisa 23/9/14
Marco Meschini
(
FI
)
10:45 - 11:05