3D/Active edge sensors with FBK
Tuesday, 29 July 2014 -
15:00
Monday, 28 July 2014
Tuesday, 29 July 2014
15:00
Introduction
-
Gian Franco Dalla Betta
(
University of Trento
)
Introduction
Gian Franco Dalla Betta
(
University of Trento
)
15:00 - 15:10
15:10
Wafer procurement
-
Gian Franco Dalla Betta
(
University of Trento
)
Giovanni Darbo
(
GE
)
Wafer procurement
Gian Franco Dalla Betta
(
University of Trento
)
Giovanni Darbo
(
GE
)
15:10 - 15:20
15:20
Planar sensor layout
-
Gabriele Giacomini
(
Fondazione Bruno Kessler FBK
)
Alberto Messineo
(
PI
)
Planar sensor layout
Gabriele Giacomini
(
Fondazione Bruno Kessler FBK
)
Alberto Messineo
(
PI
)
15:20 - 15:40
15:40
Status of 3D batch and DRIE tests
-
Sabina Ronchin
(
FBK
)
Status of 3D batch and DRIE tests
Sabina Ronchin
(
FBK
)
15:40 - 16:00
16:00
Plans for bump-bonding
-
Giovanni Darbo
(
GE
)
Alberto Messineo
(
PI
)
Plans for bump-bonding
Giovanni Darbo
(
GE
)
Alberto Messineo
(
PI
)
16:00 - 16:20
16:20
Discussion
Discussion
16:20 - 16:50
16:50
Next meeting
-
Gian Franco Dalla Betta
(
University of Trento
)
Next meeting
Gian Franco Dalla Betta
(
University of Trento
)
16:50 - 17:00