OCQ Inspection:
- So far two lots were inspected and showed defects ranging fro 0 to 20 impacted SiPM.
- One lot was more impacted than the other but the impact is pretty uniform wafer to wafer.
- The data are being uploaded to the LF-LNGS shared server and contain: 1) wafer maps in PDF; 2) spreadsheets with the impacted SiPM coordinates and type of defect (scratch, spots, black pads). Scratches and black pads are killer defects for sure.
- The data may report multiple rows of the same SiPM in case more defects are found on the same SiPM.
- Excel spreadsheets could not be so easy to be fed into the database and Stefano will provide requirements.
Business update:
- FrontSide production going to be closed by mid of June. The final batch to complete 1400 wafers is going to be started.
- Early July to complete BackSide.
- In case more wafers will be needed, besides the 1400, LFoundry will start with silicon from another vendor, due to the shortage of materials.
Cryo-Probe:
- The wafer clamp overlap with the wafer is 4mm while the edge exclusion of the LFoundry production is 3mm. Need to check how may SiPM are touched by the clamp.
Action items:
- Stefano to provide Giovanni with file format requirements (rearrange one of the provided excel files) - 17/5
- Paolo to give feedback to LF about how to close Milestone 3 w/o having the test completed - 24/5
- Kaori to estimate the number of SiPM touched by the clamp - 17/5
There are minutes attached to this event.
Show them.
